002.17 PEEC: Wirebondless SiC Power Module Packaging - Aug. 2022
SAND Number: SAND2022-16574V
Content Owner: Raymond H. Byrne ("Ray")
Presenter(s): Arun V. Gowda, GE Research
Description: Wirebondless SiC Power Module Packaging
Keywords: Science, Engineering, power electronics, Power Electronics & Energy Conversion Workshop
POC: Sarah J Johnson 08000 505/3212611
Import
Record Series: CO-102-205-100
Review Year: Review 2033
8551-1 Digital Media Operations
2/3/2023 9:46:47 PM
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